Turnkey PCB Assembly and Fabrication - Circuit Solutions

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Release Time:2018-09-26 Publisher:admin

Your Professional And Trustworthy Partner in SMT and PCB Assembly

Circuit Solutions low-volume circuit board soldering, sophisticated team, and the gold-plated board just solved these problems. 

 

For the surface mount process, especially for 0603 and 0402 ultra-small surface mount, because the flatness of the solder pad is directly related to the quality of the solder paste printing process, it plays a decisive influence on the quality of the reflow soldering. 

 

Therefore, the entire board Gold plating is common in high density and ultra-small surface mount processes. In the trial production stage, the factors such as component procurement often do not affect the welding of the board immediately. Instead, it often takes several weeks or even months before the board is used. The service life of the gold plating board is many times longer than that of the tin board. So everyone is happy to adopt it.

 

Circuit Solutions' low soldering temperature of the circuit board solder will reduce the thermal shock to the component and the substrate, help to reduce the formation of scum, under the lower strength, under the joint action of flux coating and flux compounds , It can make the outlet of wave crest have enough flux, so it can reduce the generation of burrs and solder balls. 

 

The solder composition in the solder pot is closely related to the time, as it changes with time, which leads to the formation of scum, which is the reason for the removal of residues and other metal impurities from the soldered components and the welding process. The reason for the loss in the tin. These factors can reduce the solder fluidity.

KETWORD
SMT and PCB Assembly
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